Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interfa

By Seonho Seok

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 3319778714
• ISBN13: 9783319778716
• Release Date: May 2018
• Publisher: Springer
• Length: 115 Pages
• Weight: 0.78 lbs.
• Dimensions: 0.3" x 6.1" x 9.2"