Advanced Metallization Conference 2008 (AMC 2008): Volume 24

The Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.

• Format: Hardcover
• Language: English
• ISBN: 1605111252
• ISBN13: 9781605111254
• Release Date: April 2009
• Publisher: Materials Research Society
• Length: 769 Pages
• Weight: 2.50 lbs.
• Dimensions: 1.7" x 6.2" x 9.1"