Advanced Metallization Conference 2005 (AMC 2005): Volume 21

Technical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.

• Format: Hardcover
• Language: English
• ISBN: 1558998659
• ISBN13: 9781558998650
• Release Date: January 2006
• Publisher: Materials Research Society
• Length: 782 Pages
• Weight: 2.55 lbs.
• Dimensions: 1.7" x 6.4" x 9.3"