Advanced Materials for Interconnections: Volume 66

by Michael J. Rycroft, R.H. Adagia-Hoven, Th. Gessner

The conference "Advanced Materials for Interconnections" took place in Strasbourg on 4-7 June 1996 hosted by the EMRS Society. Based on the recent trends in microelectronics the main topics of the conference were new materials for interconnects like special aluminum alloys, tungsten and copper as well as low k dielectric materials.64 Papers were presented at the conference and 51 of these are contained as full length papers within this volume of Microelectronic...

• Format: Hardcover
• Language: English
• ISBN: 0444205071
• ISBN13: 9780444205070
• Release Date: January 1998
• Publisher: Elsevier Science
• Length: 451 Pages