A new methodology for process capability analysis

By Gabriela Zárate Téllez

The continued need for size, weight and power reduction is driving electronics manufacturing towards embedding of components of Printed Circuit Boards (PCBs). Embedded components include thin film... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3639304616
• ISBN13: 9783639304619
• Release Date: November 2010
• Publisher: VDM Verlag
• Length: 120 Pages
• Weight: 0.41 lbs.
• Dimensions: 0.3" x 6.0" x 9.0"