3D Microelectronic Packaging: From Architectures to Applications

By Yan Li

Book Overview

1. Introduction to 3D microelectronic packaging

2. 3D packaging architecture and assembly process design.

3. Fundamentals of TSV processing and reliability.

4. Mechanical properties of TSV.

5. Atomistic View of TSV Protrusion/Intrusion

6. Fundamentals and failures in Die preparation for 3D packaging.

7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging.

8. Emerging hybrid bonding techniques for 3D packaging

9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging.

10. Fundamentals of solder alloys in 3D packaging.

11. Fundamentals of electro migration in interconnects of 3D packages.

12. Fundamentals of heat dissipation in 3D packaging.

13. Fundamentals of advanced materials and process in substrate technology.

14. New substrate technologies for 3D packaging

15. Thermal mechanical and moisture modeling in 3D packaging.

16. Stress and Strain measurements in 3D packaging

17.Processing and Reliability of Solder Interconnections in Stacked Packaging.

18. Interconnect Quality and Reliability of 3D Packaging.

19. Fundamentals of automotive reliability of 3D packages

20. Fault isolation and failure analysis of 3D packaging.

• Format: Paperback
• Language: English
• ISBN: 9811570922
• ISBN13: 9789811570926
• Release Date: November 2021
• Publisher: Springer
• Length: 622 Pages
• Weight: 1.95 lbs.
• Dimensions: 1.3" x 6.1" x 9.2"