3D Integration for VLSI Systems

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers that are vertically bonded and interconnected by through silicon via TSV.

There is a long string...

• Format: Hardcover
• Language: English
• ISBN: 981430381X
• ISBN13: 9789814303811
• Release Date: September 2011
• Publisher: Jenny Stanford Publishing
• Length: 378 Pages
• Weight: 1.48 lbs.
• Dimensions: 0.9" x 6.0" x 9.0"