3D IC Stacking Technology

By Banqiu Wu, Sesh Ramaswami, Ajay Kumar

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The latest advances in three-dimensional integrated circuit stacking technology

With a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.

3D IC Stacking Technology covers:

High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology

• Format: Hardcover
• Language: English
• ISBN: 007174195X
• ISBN13: 9780071741958
• Release Date: July 2011
• Publisher: McGraw-Hill Companies
• Length: 544 Pages
• Weight: 1.70 lbs.
• Dimensions: 0.9" x 5.9" x 9.0"