1997 IEEE International Conference on Innovative Systems in Silicon

By Institute of Electrical and Electronics Engineers, IEEE Components Packaging & Manufacturing Technology Society, Texas) International Conference on Innovative Systems in Silicon (2nd : 1997 : Austin

This conference provides a broad view of the diverse arena of innovation. From this perspective, a variety of approaches under investigation and development is assessed. The focus is on many aggressive extensions of circuit and packaging technologies which are addressing various limitations.

• Format: Hardcover
• Language: English
• ISBN: 0780342755
• ISBN13: 9780780342750
• Release Date: January 1997
• Publisher: IEEE
• Length: 374 Pages
• Weight: 1.11 lbs.
• Dimensions: 5.9" x 9.1"