11th International Congress Molded Interconnect Devices - Scientific Proceedings: Selected, Peer Reviewed Papers from the 11th International Congress ... Fuerth, Germany (Advanced Materials Research)

Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped... This description may be from another edition of this product.

• Format: Paperback
• Language: English
• ISBN: 3038352527
• ISBN13: 9783038352525
• Release Date: November 2014
• Publisher: Trans Tech Pubn
• Length: 124 Pages
• Weight: 0.90 lbs.
• Dimensions: 9.3" x 0.3" x 6.8"