- Copper-Fundamental Mechanisms for Microelectronic Applications
- Chemical Mechanical Planarization of Microelectronic Materials
- Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology
- Chemical-Mechanical Polishing of Low Dielectric Constant Polymers and Organosilicate Glasses: Fundamental Mechanisms and Application to IC Interconnect Technology