John H. Lau

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies

John H. Lau

Out of Stock

Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)

John H. Lau

$33.99 - $219.99

Solder Joint Reliability: Theory and applications

John H. Lau

$219.99

Electronic Packaging: Design, Materials, Process, and Reliability

John H. Lau

$16.29 - $18.59

Ball Grid Array Technology

John H. Lau

$10.59

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

$9.59

Mechanics of Solder Alloy Interconnects (Electrical Engineering)

John H. Lau

$219.99

Flip Chip Technologies

John H. Lau

$8.29

Microvias: For Low Cost, High Density Interconnects

John H. Lau

Out of Stock

Handbook Of Tape Automated Bonding

John H. Lau

$23.19 - $219.99

Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials

John H. Lau

Out of Stock

Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)

John H. Lau

$11.49

Chip Scale Package: Design, Materials, Process, Reliability, and Applications

John H. Lau

$22.09

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

John H. Lau

$15.89 - $140.60

Through-Silicon Vias for 3D Integration

John H. Lau

$179.00

Advanced MEMS Packaging

John H. Lau

Out of Stock

3D IC Integration and Packaging

John H. Lau

$218.00

Heterogeneous Integrations

John H. Lau

$179.99

Semiconductor Advanced Packaging

John H. Lau

$119.99 - $179.99

Assembly and Reliability of Lead-Free Solder Joints

John H. Lau

$129.99 - $179.99

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

$139.99 - $199.99