Electronic Components Failure Analysis: Methods and Experience for Beginners

By: Sung, Tsai Feng

Electronic Components Failure Analysis for Beginners: Methods and Experience

A Practical Guide to Instrument-Based Failure Diagnosis for Beginners

This book provides practical experience in electronic factories for students majoring in electronics, beginners in electronics, and professionals in the electronics industry. It covers topics not taught in schools and introduces the causes of electronic component failure analysis.

The colorful graphic analysis report allows you to absorb the author's years of experience. Beginners can learn a lifetime's worth of analysis tools in one go and quickly accumulate a year's worth of expertise.

Content includes:

BGA analysis

DYE and PRY test

2D/3D X-ray analysis

Silver migration analysis

EDX energy dispersive spectroscopy reports

Sulfurization test, Flux, foreign matter intrusion, salination, and carbon deposit analysis

Soldering ability test

FTIR Fourier transform infrared spectrometer reports

XRF fluorescent X-ray hazardous substance analyzer reports

LED popcorn stress failure

Electrostatic damage

C-SAM ultrasonic inspection

And various component failure analysis reports.

• Format: Paperback
• Language: English
• ISBN: 6260154186
• ISBN13: 9786260154189
• Release Date: December 2025
• Publisher: Sung Tsai Feng Isbn: 978-626-01-5418-9
• Length: 92 Pages
• Weight: 0.70 lbs.
• Dimensions: 0.3" x 8.3" x 11.7"