Chemical-Mechanical Polishing - Fundamentals and Challenges: Volume 566

Book Overview

Chemical-mechanical planarization (CMP) has emerged over the past few years as a key enabling technology in the relentless drive of the semiconductor industry towards smaller, faster and less... This description may be from another edition of this product.

• Format: Hardcover
• Language: English
• ISBN: 1558994734
• ISBN13: 9781558994737
• Release Date: February 2000
• Publisher: Cambridge University Press
• Length: 281 Pages
• Weight: 1.30 lbs.
• Dimensions: 0.9" x 6.2" x 9.2"